Volume 26 Issue 3
Sep.  2012
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Article Navigation >  Journal of Shanghai University of Engineering Science  > 2012  >  26(3): 267-271
YANG Gansheng, YU Zhishui. Research Progress of Tin Whisker Growth on Surface of Lead-Free Solder Joints with Rare-Earth Phase[J]. Journal of Shanghai University of Engineering Science, 2012, 26(3): 267-271. doi: 10.3969/j.issn.1009-444X.2012.03.018
Citation: YANG Gansheng, YU Zhishui. Research Progress of Tin Whisker Growth on Surface of Lead-Free Solder Joints with Rare-Earth Phase[J]. Journal of Shanghai University of Engineering Science, 2012, 26(3): 267-271. doi: 10.3969/j.issn.1009-444X.2012.03.018
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Research Progress of Tin Whisker Growth on Surface of Lead-Free Solder Joints with Rare-Earth Phase

doi: 10.3969/j.issn.1009-444X.2012.03.018
  • Publish Date: 2012-09-30

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