Research progress on Reactive Wetting and Interfacial Structure of Metal-Ceramic Soldering Systems

CHEN Jie; YU Zhi-shui; LIU Lei; XIANG Feng

doi:10.3969/j.issn.1009-444X.2010.01.019

Volume 24 Issue 1

Mar. 2010

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Article Navigation > Journal of Shanghai University of Engineering Science > 2010 > 24(1): 83-88

CHEN Jie, YU Zhi-shui, LIU Lei, XIANG Feng. Research progress on Reactive Wetting and Interfacial Structure of Metal-Ceramic Soldering Systems[J]. Journal of Shanghai University of Engineering Science, 2010, 24(1): 83-88. doi: 10.3969/j.issn.1009-444X.2010.01.019

Citation:

CHEN Jie, YU Zhi-shui, LIU Lei, XIANG Feng. Research progress on Reactive Wetting and Interfacial Structure of Metal-Ceramic Soldering Systems[J]. Journal of Shanghai University of Engineering Science, 2010, 24(1): 83-88. doi: 10.3969/j.issn.1009-444X.2010.01.019